Egis Technology Inc's fleet is heading to MWC 2026! From satellites to drones, AI chips are not absent.

Egis Technology Inc focuses on the achievements of hybrid satellite IoT cross-orbit integration, combining the 3GPP NTN multi-orbit satellite architecture (GEO, LEO) with multi-protocol technologies such as LoRaWAN, BLE Mesh, and DECT NR+, enabling seamless switching between terrestrial and satellite networks. The four core applications include SOS satellite emergency nodes, drone reconnaissance aerial hybrid satellite communication platforms, Atlas NTN vehicle global connectivity solutions, and Hestia X hybrid satellite terminal devices, enhancing the resilience of global connectivity to meet the demands of disaster prevention, inspection, energy, and remote areas.

 

ENE Technology Inc. unveiled the next-generation "AI Eye" multimodal visual perception system at MWC, built on the NVIDIA Jetson Thor platform, and jointly developed an overall image integration architecture with NVIDIA Elite Partner Appro (6560.TWO). The system also integrates the iCatch HSB (Holoscan Bridge) module from iCatch Technology, responsible for high-speed image bridging and data flow optimization, ensuring stable transmission of multimodal sensing data in low-latency environments. The AI Eye utilizes the latest architecture from Egis Technology Inc. with 4D sensing components, combining RGB, DVS, and ToF multimodal sensing technologies with edge AI inference capabilities, achieving sensing, recognition, and action prediction in milliseconds, enabling real-time obstacle avoidance in high-speed dynamic scenes, precise depth perception, stable recognition in extreme lighting conditions, and successfully integrating digital twin architecture into physical AI applications, establishing a high-precision, low-latency visual core for drones and robots.

 

ENE Technology Inc made its debut at MWC with a complete drone solution, officially extending from semiconductor IC design to smart flight system integration. Its high-end drone platform integrates Egis Technology Inc satellite communication modules, a "Data and Control Integrated" ground station system, Alcor Micro Corp.'s "AI Eye" visual algorithm, high-speed image bridging technology from Chipone Technology, and imaging integration capabilities from Sinpro. Even in remote or signal-restricted environments, it can be stably controlled and transmit high-definition images with ultra-low latency. The ENE Inspector lightweight smart drone was showcased on-site, targeting high-difficulty areas such as indoors, narrow passages, and underground conduits, significantly enhancing autonomous navigation and flight safety through sensor fusion and flight control collaboration.

 

Alcor Micro Corp. showcases the world's first Arm-based CSS CPU architecture system Chiplet, demonstrating a CPU chiplet solution from chip, packaging to system level. Alcor adopts Arm CSS V3 CPU IP, dry vision UCIe, and TSMC's 3-nanometer process to design Taiwan's first CPU chip Mobius100, which will realize the industry's first architecture that complies with the Arm Chiplet System Architecture and the future OCP specifications for an Arm-based CSS CPU chiplet, capable of interfacing with AI computing small chips to ensure interoperability across ecosystems. This time, the focus will be on demonstrating the interconnection transmission computing technology of the Mobius100 chiplet on a simulation emulator, showcasing a high-bandwidth, scalable interconnection architecture, which will be combined with AI accelerator partners from Europe, the United States, and South Korea to concretely implement heterogeneous multi-chip high-speed computing systems. In addition, this interconnection technology will also extend to the physical AI landscape and integrate various AI application technologies within Egis Technology Inc, providing the highest flexibility in architecture at the system level to accelerate time-to-market.

 

Yubao Technology showcases the FalneX ultra-low latency wireless transmission technology specifically designed for drone and robot applications, achieving a minimum transmission delay of 1ms and a high frame rate wireless image transmission of 60fps. In high-speed dynamic environments, FalneX provides near-synchronous visual feedback and precise control capabilities, enhancing real-time obstacle avoidance and flight stability for drones, remote control for robots, and real-time image transmission for smart inspections, becoming a key low-latency communication foundation in Physical AI systems.

 

Egis Technology Inc showcases the Always-On ultra-low power contextual detection AI chip, applicable for laptop user behavior recognition and smart energy management, extending battery life and enhancing privacy protection. At the same time, it can be paired with LoRa wireless modules, expanding into ultra-low power AIoT application scenarios, achieving long-term stable operation and low maintenance cost deployment.